VT200 eMMC 5.0 Industrial Embedded Storage IC
High-performance, low-power embedded storage solution engineered for mobile terminals, automotive navigation, industrial IoT, and multifunction printers. Fully compliant with JEDEC eMMC 5.0, featuring HS400 bus timing, Field Firmware Updates (FFU), and Industrial Operating Temperature (-40°C to 85°C).
Advanced NAND Management & Core eMMC 5.0 Benefits
Uniting high-functionality controller silicon with standard NAND flash media to maximize bus transfer efficiency and NAND endurance.
HS400 High-Speed Bus & JEDEC 5.0 Conformance
The VT200 series strictly adheres to JEDEC eMMC 5.0 specifications, supporting 1-bit, 4-bit, and 8-bit programmable bus widths. Introducing HS400 timing modes delivering data transfer rates up to 400MB/s at clock frequencies up to 200MHz to substantially elevate system data throughput.
ShieldPower & DataPhoenix Power Loss Shielding
Built-in advanced PowerShield and DataPhoenix circuitry establish hardened data protection and rapid autonomous recovery during sudden outages. Reinforced with low-power configurable ECC engines and dynamic global Wear Leveling algorithms to eliminate bit-error corruption and lengthen silicon service life.
Industrial Operating Temperature and Field Firmware Updates (FFU)
Tailor-made for demanding industrial and automotive cabin conditions, operating reliably between -40°C and +85°C. Features in-field Field Firmware Updates (FFU), device health telemetry reporting, Secure Erase, and Replay Protected Memory Block (RPMB) to satisfy communications, smart edge, and ruggedized computing requirements.
VT200 eMMC 5.0 Series Comprehensive Technical Specifications
| Parameter | Specification / Performance Metric |
|---|---|
| Interface Standard | Complies with JEDEC eMMC 5.0 (HS400 Mode, Max 200MHz) |
| Capacity Options | 4GB, 8GB, 16GB, 32GB, 64GB |
| Supply Voltages | VCCQ (I/O): 1.70~1.95V / 2.7~3.6V; VCC (Core): 2.7~3.6V |
| Operating Temp Grade | Industrial Grade: -40°C to +85°C |
| Package Form Factor | 100-Ball / 153-Ball BGA Green Package (RoHS Compliant) |
| Core Enterprise Features | FFU Firmware Upgrades, Device Health Report, RPMB Secure Partitioning, PSA Architecture, Global Wear Leveling |
| Target Applications | Smartphones, Automotive Infotainment, Fleet Navigation, Multifunction Printers, POS Terminals, Telecom Networking & Industrial Automation |